반도체 패키징 샘플 비즈니스 패키징 제조 공정 개발
Semiconductor Package
Wafer Back Grinding
-. 8inch, 12inch , MPW Chip Back Grinding
Dicing (Sawing)
Wire Bonding
Au Stud bumping
Substrate SMT
위탁 서비스.
Glass Flip Chip Bonding
-. Au Bump ↔ Glass Substrate
-. Glass Interposer Substrate
SnAg Flip Chip Bonding
-. Solder Ball, Cu-pillar bump
COF Flip Chip Bonding
-. Au Bump↔Sn/Au Bump↔Ti
TEW-Test Engineer Wafer
-. Wafer&Substate 제작/실장 서비스